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US awards GlobalFoundries $300M to develop faster AI chip interconnect technology

The US government granted GlobalFoundries $300 million to accelerate development of high-speed interconnect chips used in AI accelerators. The subsidy is part of broader domestic semiconductor resilience strategy under CHIPS Act.

WHY IT MATTERS

Government funding for AI infrastructure chips signals policy commitment to onshore advanced compute capacity—financial firms should expect reduced vendor concentration risk and potential for clearer supply chain transparency over 3–5 years.

Source: Reuters · 2026-07-29

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US awards GlobalFoundries $300M to develop faster AI chip interconnect technology — ath — AITechHive